13th International
SoC Design Conference

October 23 ~ 26, 2016
Ramada Plaza Jeju Hotel, Jeju Korea

Keynote Speakers

October 24 (Monday), 2016

[Keynote #1-1] 9:15 AM~10:00 AM

Title : Innovation in the Age of Smart Everything

Deirdre Hanford
Executive Vice President, Customer Engagement, Synopsys, USA

Deirdre Hanford is Executive Vice President, Customer Engagement. In her current role, her organization's mission is to ensure the successful adoption of the company's technology into customers' demanding environments. In addition, Ms. Hanford oversees Synopsys’ engagements with its key customers and ecosystem partners.

Ms. Hanford has held a variety of positions, including leadership roles in applications engineering, sales and marketing. In 2001, Ms. Hanford was a recipient of the YWCA Tribute to Women and Industry (TWIN) Award and the Marie R. Pistilli Women in EDA Achievement Award. Ms. Hanford served as the Chairman of American Electronics Association in 2008. She currently chairs Brown University’s Engineering Advisory Committee and serves on the Engineering Advisory Board for UC Berkeley’s College of Engineering.
Ms. Hanford earned a BSEE from Brown University and an MSEE from UC Berkeley.

Smart Everything is here, driving the next wave of innovation forward. Virtual reality and computer vision are transforming work and entertainment. Autonomous driving and advanced driver assist advancements are revolutionizing and disrupting the automobile industry. Machine learning is transforming how professionals leverage compute power.

Hardware and software designers face challenges as they create the SoCs to enable these innovations. Additionally, the adoption and deployment of smart everything solutions is complicated by security concerns. Ms. Hanford’s presentation will explore how the demand for secure and innovative solutions is driving engineers to create ever faster, smarter, and safer SoCs.

[keynote #1-2] 10:00 AM~10:45 AM

Title : IC Design Challenges for Big Digital Semiconductor Companies

Kou-Hung Lawrence Loh, Ph.D.
Corporate Senior Vice President, MediaTek Inc., President, MediaTek USA Inc., USA

Dr. Kou-Hung Lawrence Loh is a Corporate Senior Vice President of MediaTek Inc. He oversees the company’s Central Engineering Group, responsible for engineering the company’s SOCs and chipsets design, development and implementation activities for all MediaTek’s product lines including mobile communication, application processors, wireless connectivity, IOT, automotive, home entertainment, optical storage and broadband/networking business. He is also serving as President of MediaTek USA responsible for the company’s global operations in Europe and America. Dr. Loh started his first circuit design position at IMP and later he joined Cirrus Logic, where his last position was Director of Analog IC Engineering. In 1998, Dr. Loh founded Silicon Bridge Inc., where he successfully led a number of analog/mixed-signal IC development projects with major semiconductor companies including MediaTek and Altera Corporation. Before joining MediaTek in 2004, Dr. Loh had contributed to IC design industry in areas of read/write channels for magnetic and optical storage, high-performance analog filters, solid-state fingerprint sensors, high-speed SERDES and wireline transceivers for various business applications.

Dr. Loh received his Ph.D. degree in Electrical Engineering from Texas A&M University, College Station, Texas. He has authored/co-authored dozens of technical papers/patents in areas of analog and mixed-signal integrated circuits/systems design and has contributed many panel talks and invited keynote speeches at numerous international conferences and professional communities. Dr. Loh had served on ISSCC International Technical Program Committee for 5 consecutive years since 2005. He is currently serving on Steering Committee of A-SSCC and also on Board of Directors for Global Semiconductor Alliance (GSA).

Recent consolidations in semiconductor industry have led to fewer mega-sized companies. IC product companies have been generally categorized into two distinctive groups: ‚Äėbig digital‚Äô companies to continue to invest in most advanced IC fabrication technologies to chase after Moore‚Äôs Law, and ‚Äėnon big digital‚Äô companies to squeeze out more juices from more matured processes. MediaTek, as one of the most representative big digital companies, would need to provide multiple ICs to enable its increasingly complicated and demanding ‚Äėintegrated platforms‚Äô including digital-intensive SOCs and companion chips to support various less-to-non-digital functions such as power management, analog/mixed-signal and RF functions. IC designers of big digital companies therefore face unprecedented challenges to deal with increasing complexities and non-idealities caused by increasingly sophisticated processes, more demanding system performances and cost pressures. In this presentation we will share issues and challenges which IC design engineers of big digital companies have been facing and dealing with their solid technical skills, experiences and innovations/creativities.

[keynote #1-3] 11:00 AM~11:45 AM

Title : Sensorization in automotive IoT

Seo-Kyu Lee, Ph.D.

Dr. Seo-Kyu Lee is the founder and CEO of PIXELPUS. PIXELPLUS is a fabless semiconductor company that researches, develops and manufactures image sensors and imaging solutions. PIXELPLUS has been focusing on security and monitoring camera solutions and automotive camera solutions, and offers total solutions for image sensor-based camera applications by penetrating medical and home application markets in the future.

Chairman Lee since April 2000. Prior to Pixelplus, he served as CMOS image sensor project leader as well as CCD research and development team leader at LG Semiconductor Co., Ltd. In addition, he also served as a design team leader in CCD development division and held various engineer positions at LG Semiconductor Co., Ltd. Dr. Lee received a Ph.D. in electronic and electrical engineering from Pohang University of Science & Technology in 1997, a master's degree in electrical engineering from Yonsei University in 1993 and a bachelor's degree in physics and electronic engineering from Sogang University in 1985.

Understanding IoT, what does it mean for automotive business in IoT and what is the trend for automotive tech, apply sensors in autonomous vehicle, ADAS system and challenges. Automotive market player partnership status and trend of sensorization.

[keynote #1-4] 11:45 AM ~12:30 PM

Title : Smart Products: Complexity, Security & Collaboration

Tom Beckley
Senior Vice President & General Manager of the Custom IC & PCB Group, Cadence, USA

Tom Beckley is Senior Vice President and General Manager of the Custom IC & PCB Group. His product responsibilities include the Virtuoso¬ģ design environment, physical design and routing, and simulation product lines for full-custom digital and analog design; infrastructure such as the OpenAccess database and the process design kits (PDKs) that are essential for physical IC design; the Allegro¬ģ and OrCAD¬ģ design and routing solutions; and Sigrity‚ĄĘ high-speed analysis solutions for PCBs and IC packaging.

In addition, Beckley is executive sponsor of the Cadence Quality Initiative, a sustained corporate focus on developing and deploying processes enabling design, implementation, and delivery of high-quality, full-featured products.

Beckley joined Cadence in 2004 via the acquisition of Neolinear, where he served as President and CEO. Neolinear developed innovative auto-interactive and automated analog/RF tools and solutions for mixed-signal design. Prior to Neolinear, Beckley was head of the Systems Division at Avant! Corporation. He came to Avant! through the acquisition of Xynetix Design Systems, the market leader in advanced IC packaging and systems-level virtual prototyping, where he was President and CEO. Prior to Xynetix, Beckley held engineering and management positions at Harris Corporation and General Motors.

Beckley received his B.S. in mathematics and physics from Kalamazoo College and an MBA from Vanderbilt University.

We are at an early stage in the world’s most significant electronics/software-driven transformation. The rapid unfolding of the autonomous vehicle is but one example. From Tesla to Google to Uber to Nvidia to Samsung, practically every semiconductor, software and systems company is looking to be part of the driverless car opportunity. Mobile devices are similarly transforming. Today, they comprise high performance computers, radios, sensors, and more enabling a vast software stack and thousands of software apps. Smart phones are quickly becoming personal computing hubs that access and enable IoT devices for health, gaming, home management and more. While the driverless car includes robotics and AI, advanced node processor scaling is providing unprecedented cost effective, high performance compute power. When coupled with ultra-fast, high capacity memory from leading suppliers including SK Hynix and Samsung, along with Cloud access, new opportunities unfold for semis and systems across industrial and home robotics, data mining, and more.

This presentation will focus on new methods and solutions for designing, verifying and assessing functional safety/security for our unfolding world of smart, interconnected products. These Smart Product systems include multiple complex hardware technologies ‚Äď SoCs, radios, MEMs, high speed boards ‚Äď and an ever growing software stack.

October 25 (Tuesday), 2016

[Keynote #2-1] 9:15 AM~10:00 AM


Walden C. Rhines, Ph.D.
Chief Executive Officer and Chairman of the Board of Directors, Mentor Graphics, USA

WALDEN C. RHINES is Chairman and Chief Executive Officer of Mentor Graphics, a leader in worldwide electronic design automation with revenue of about $1.2 billion in 2015. During his tenure at Mentor Graphics, revenue has nearly quadrupled and Mentor has grown the industry’s number one market share solutions in four of the ten largest product segments of the EDA industry.
Prior to joining Mentor Graphics, Rhines was Executive Vice President of Texas Instruments’ Semiconductor Group, sharing responsibility for TI’s Components Sector, and having direct responsibility for the entire semiconductor business with more than $5 billion of revenue and over 30,000 people.

During his 21 years at TI, Rhines managed TI‚Äôs thrust into digital signal processing and supervised that business from inception with the TMS 320 family of DSP‚Äôs through growth to become the cornerstone of TI‚Äôs semiconductor technology. He also supervised the development of the first TI speech synthesis devices (used in ‚ÄúSpeak & Spell‚ÄĚ) and is co-inventor of the GaN blue-violet light emitting diode (now important for DVD players and low energy lighting). He was President of TI‚Äôs Data Systems Group and held numerous other semiconductor executive management positions.
Rhines has served five terms as Chairman of the Electronic Design Automation Consortium and is currently serving as a director. He is also a board member of the Semiconductor Research Corporation and First Growth Children & Family Charities. He has previously served as chairman of the Semiconductor Technical Advisory Committee of the Department of Commerce and as a board member of the Computer and Business Equipment Manufacturers' Association (CBEMA), SEMI-Sematech/SISA, Electronic Design Automation Consortium (EDAC), University of Michigan National Advisory Council, Lewis and Clark College and SEMATECH.

Dr. Rhines holds a Bachelor of Science degree in metallurgical engineering from the University of Michigan, a Master of Science and Ph.D. in materials science and engineering from Stanford University, a master of business administration from Southern Methodist University and an Honorary Doctor of Technology degree from Nottingham Trent University.

Since 1995, the number of bits of FLASH memory produced each year has been growing at an 85% compound average growth rate while the cost per bit decreased more than 45% per year. While the balance between logic and memory transistors was approximately equal in the early 1990’s, memory bits constitute 99.7% of all transistors produced today. This change in the memory-to-logic transistor ratio is a major step toward filling the need for improved pattern recognition, a requirement to intelligently process, store, retrieve and make use of the rapidly growing petabytes of photographic, video and audio data. Further advances in memory and processor technology will result in a discontinuity in computer architectures. Dr. Rhines will analyze this evolution and demonstrate how brain-like computer architecture features will make the IOT-generated base of sensor data much more valuable.

[keynote #2-2] 10:00 AM~10:45 AM

Title : Extremely Low-Leakage memory and logic circuits based on Tunneling-FET device

Amara Amara, Ph.D.
Professor, Director of Research, ISEP(Institu Supérieur d'Electronique de Paris), France
IEEE CASS ExCom, Vice-President for Conferences, President IEEE France Section

Prof. Amara AMARA obtained Ph.D. in computer science in 1989 and a Master in 1984 in microelectronics and computer science from Pierre and Marie Curie University (Paris VI). In 1988 he joined IBM research and development laboratory at Corbeil-Essonnes as invited researcher where he was involved in SRAM memory design with advanced CMOS technologies. From 1989 to 1992, he was associate professor developing microelectronics academic programs for CEMIP (Microelectronic Center of Paris Iles-de-France) and took part actively in many European Research Projects. In 1992, he joined ISEP (Paris Institute for Electronics) in charge of the microelectronics laboratory where he headed a joint team (Paris VI and ISEP) involved in High Speed GaAs VLSI circuit design and developed curricula in Microelectronics. He was involved in education management and research management for almost 34 years. Currently he is Deputy Managing Director of ISEP in charge of Research and International Cooperation. His research interests are mainly focusing on Low Power and Low Voltage circuit design techniques and on Circuit and Device Co-design for advanced technologies (SOI, DGates FD SOI, Ultra Thin Body SOI, T-FET…). In 1999, he spent his sabbatical at Stanford University working as a visiting researcher in Professor De Micheli’s group.

He launched a well-established laboratory called LISITE, which is now composed of 21 researchers, 18 PhD students split over 3 teams in addition to visiting scholars and visiting researchers. The laboratory is mostly funded by industry through collaborative research projects or bilateral research agreements.

Amara has a strong activity within IEEE since he joined this prestigious organization in 1992. He has been Vice President of the French IEEE Section since January 2004. He has been elected President of the IEEE France Section for a 3 years term starting from January 2014. From 2000 to 2004 he was Chairman of the IEEE-CAS France Chapter (Recipient of the 2004 Best Chapter of the Year Award and a Certificate of Appreciation from IEEE Regional Activities), he was member of the IEEE CASS Board of Governors (2008-2014) and was elected in November 2013 member of CASS Executive Committee as Vice President for Conferences (term 2014-2015) and reelected in November 2015 in the same position for the term 2016-2017. As VP for conferences he is the Chair of ISCAS (IEEE CASS Flagship Conference) Steering Committee. As President of the IEEE France Section, he represents France in the IEEE Region 8 board.

Amara is member of numerous Conference Technical Program Committees and Conference organizing Committees, member of the Editorial Board of Microelectronics Journal (ELSEVIER). He chaired IEEE ICICDT 2008 in Grenoble and IEEE ISCAS 2010 in Paris for which he has been awarded the Bronze Medals respectively of the cities of Grenoble and Paris.
Amara published a book on Molecular Electronics (more than 3000 chapters downloads from Elsevier web site) and co-edited two books: ‚ÄúDouble-Gate FD SOI devices and circuits‚ÄĚ and ‚ÄúEmerging Technologies and Circuits‚ÄĚ. He is author of 6 patents and co-author of numerous papers published in IEEE conferences and journals. He supervised 20 PhD students on subjects related to his research interests.

Nowadays CMOS transistors have become too leaky and have weak performance at low voltage. CMOS leakage is increasing with technology scaling and is of critical concerns for circuit designers. In advance technology nodes, it has been the limiting factor in improving the performance, especially at low voltages. There are various techniques that minimize leakage currents but never eliminate them systematically. In this presentation, we will introduce a new Tunneling FET (T-FET) structure developed in our laboratory and show how to use it to obtain innovative and efficient systems in terms of power consumption. New memory architectures and a new paradigm for designing logic circuits will be presented.

[keynote #2-3] 11:00 AM~11:45 AM

Title : Ultra Low Power SoC for Healthcare: Challenges and Future

Yong Lian, Ph.D.
Professor, York University, Canada
Fellow of IEEE and Fellow of Academy of Engineering Singapore

Dr. Yong Lian received the B.Sc degree from College of Economics & Management of Shanghai Jiao Tong University in 1984 and the Ph.D degree from the Department of Electrical Engineering of National University of Singapore (NUS) in 1994. He worked in industry for more than 9 years before joining NUS in 1996. He was appointed as the first Provost’s Chair Professor in the Department of Electrical and Computer Engineering in 2011. Currently, he is a professor in the Department of Electrical Engineering and Computer Science of York University. His research interests include low power techniques, continuous-time signal processing, biomedical circuits and systems, and computationally efficient signal processing algorithms. He has received more than US$25 million in research funds from various sources. He is the Founder of Clearbridge VitalSigns Pte Ltd, a start-up for commercializing wireless biomedical sensor technologies.

Dr. Lian received more than 20 awards for his research including the 1996 IEEE Circuits and Systems Society's Guillemin-Cauer Award, the 2008 Multimedia Communications Best Paper Award from the IEEE Communications Society, 2011 IES Prestigious Engineering Achievement Award, 2012 Faculty Research Award, 2013 Outstanding Contribution Award from Hua Yuan Association and Tan Kah Kee International Society, 2014 Chen-Ning Yang Award in Science and Technology for New Immigrant, and the latest 2015 Design Contest Award in 20th International Symposium on Low Power Electronics and Design. He is also the recipient of the National University of Singapore Annual Teaching Excellence Awards in 2009 and 2010, respectively.

Dr. Lian is the President-Elect of the IEEE Circuits and Systems (CAS) Society, Steering Committee member of the IEEE Transactions on Biomedical Circuits and Systems. He was the Editor-in-Chief of the IEEE Transactions on Circuits and Systems II for two terms from 2010 to 2013. He served many positions in the IEEE CAS Society including Vice President for Publications, Vice President for Asia Pacific Region, Chair of the Biomedical Circuits and Systems Technical Committee, Chair of DSP Technical Committee, Distinguished Lecturer, etc. He is the founder of several conferences including BioCAS, ICGCS, and PrimeAsia. Dr. Lian is a Fellow of IEEE and Fellow of Academy of Engineering Singapore.

According to the World Health Organization’s 2008 report, the top three leading causes of death worldwide are coronary heart disease, cerebrovascular diseases, and lower respiratory infections. Governments and biomedical companies are pouring millions of dollars into research and development to find solutions for these diseases, and technological platforms to support disease management. Wireless biosensors are one such platform, with their ability to measure vital signs that indicate the presence, or onset, of pathology. According to the report from Wearable World, the wearable market for mobile health applications and associated devices will grow at a compound annual growth rate of 61% to reaching $26 billion in revenue by 2017. The market and economic forces drive the development of ultra-low power wearable wireless biomedical sensors. SoC solutions that integrate sensors, analog, digital logic, memory, RF, energy harvesters and power management will become the norm in the IoT era. This talk will discuss the challenges in the design of self-powered wearable wireless biomedical sensor chip including regulatory requirements, skin-electrode interface, design considerations of analog frontend, ADC, signal processing, and wireless transceiver. The focus is on the low power system architecture that utilizes the continuous-in-time and discrete-in-time (CTDA) signal flow to maximize energy efficiency.

[Keynote #2-4] 11:45 AM ~12:30 PM

Title : Powering Intelligent IoT Microsensors

Gabriel A. Rincón-Mora, Ph.D.
Professor, Georgia Institute of Technology, USA

Prof. Gabriel A. Rincón-Mora worked for Texas Instruments in 1994-2003, was an Adjunct Professor at Georgia Tech in 1999-2001, and has been a Professor at Georgia Tech since 2001 and a Visiting Professor at National Cheng Kung University in Taiwan since 2011. He is a Fellow of the IEEE and a Fellow of the IET, and his scholarly products include 9 books, 4 book chapters, 38 patents issued, over 170 publications, over 26 commercial power-chip designs, and over 110 invited talks. Awards include the National Hispanic in Technology Award from the Society of Professional Hispanic Engineers, the Charles E. Perry Visionary Award from Florida International University, a Commendation Certificate from the Lieutenant Governor of California, the IEEE Service Award from IEEE CASS, the Orgullo Hispano and the Hispanic Heritage awards from Robins Air Force Base, and two "Thank a Teacher" certificates from Georgia Tech. Georgia Tech inducted him into the Council of Outstanding Young Engineering Alumni in 2000 and Hispanic Business magazine named him one of "The 100 Most Influential Hispanics" in 2000.

Wireless microsensors can not only monitor and manage power consumption in small- and large-scale applications for space, military, medical, agricultural, and consumer markets but also add energy-saving and life-saving intelligence to large infrastructures and tiny devices in remote and difficult-to-reach places. Ultra-small systems, however, cannot store sufficient energy to sustain monitoring, interface, processing, and telemetry functions for extended periods. And replacing or recharging the batteries of hundreds of networked nodes is prohibitive, and often impossible. This is why alternate sources are the subject of ardent research today. Except, power densities are low, and in some cases, intermittent, so supplying functional blocks is challenging. Plus, tiny lithium-ion batteries and super capacitors, while power dense, cannot sustain life for long. This keynote illustrates emerging charger-supply systems that draw power from tiny energy-harnessing transducers, inductively coupled coils, fuel cells, and batteries to sustain microsystems for extended periods.